2017 spring season conferences picked up DIMENSION contributions

Spring season does not only bring life back to nature. Also the conference landscape is blooming in March and April. Therefore, aspects of the DIMENSION project have been introduced at several conferences:

The Optical Fiber Communication Conference and Exhibition (OFC) which is the wold largest conference in the field took place 19-23 March in Los Angeles, USA. DIMENSION was present there with two talks from project partners IHP and IBM on III-V on silicon integration technology and silicon photonics.

From 27-31 March the DATE conference took place in Lausanne, Switzerland where IBM presented about electro-optical integration technology for high-bandwidth optical interconnects.

Project partner ADVA presented on photonic integrated circuits for data center interconnects on 03 April at European Conference on Integrated Optics (ECIO) in Eindhoven, the Netherlands.

From 08 to 09 May 2017 there was the International Meeting on Integrated Photonics in Shanghai, China. DIMENSION was represented by IBM in a talk on CMOS-embedded III-V on Silicon laser sources.

 

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