In the scope of DIMENSION, TU Dresden presents the design and measurements of a monolithically integrated 50 Gb/s photonic receiver manufactured in 0.25 μm SiGe Continue reading TUD publishes electronic-photonic integrated receiver
Due to COVID-19, the 9th project meeting of the DIMENSION consortium takes not place at IBM in Zurich. Instead the meeting will be held completely Continue reading 9th project meeting goes virtual
DIMENSION has been extended by eight months to finalize its activities. The project runs now until end of September 2020.
Project partner ADVA is one of the main driver on IC-TROSA ( Integrated Coherent Transmitter-Receiver Optical Subassembly). In September 2019 the OIF approved the corresponding Continue reading OIF Approves IC-TROSA Implementation Agreement
The 9th project meeting of the DIMENSION consortium is intended to take place on 02 April 2020 at IBM in Zurich.
The next project meeting of the DIMENSION consortium will take place on 08 October 2019 in Edinburgh, Scotland, UK. Located close to the project partner Continue reading 8th Plenary Project Meeting ahead
Several partners of the DIMENSION consortium like AIT, ADVA, IBM, IHP and Optocap will be present and involved in the 45th European Conference on Optical Continue reading DIMENSION at ECOC 2019
On 09.-13.07.2019 the 21th International Conference of Transparent Optical Network (ICTON) takes place in Angers, France. DIMENSION project partner will have two invited talks on Continue reading DIMENSION partner AIT at ICTON 2019
The DIMENSION project partners IBM and AIT will attend the OFC 2019 and present their recent results.
By end of January 2019, the second project phase of DIMENSION was finalized with submission of several reports including D1.5, see Deliverables.
On 2nd April 2019, the DIMENSION project partners will meet the representatives from EC and external experts in Brussels to present and discuss about the Continue reading DIMENSION looks forward to 2nd review meeting
In November 2018 the first full EPIC wafer run including III-V devices, silicon photonics and electronics was started.
DIMENSION project partner IBM were successful in publish two of their significant results in renowned IEEE Journal of Selected Topics in Quantum Electronics. The contributions Continue reading IBM achieved two significant publications
Presented by Yannick Baumgartner, project partner IBM received the Best Student Paper Award on their publication “CMOS-Compatible Hybrid III-V/Si Photodiodes Using a Lateral Current Collection Continue reading IBM receives Best Student Paper Award at ECOC 2018
During 61st International Midwest Symposium on Circuits and Systems (MWSCAS) in August and International Conference on Photonics in Switching and Computing (PSC) in September, TU Continue reading TU Dresden presented high-swing modulator drivers
In advance to the PSC 2018, DIMENSION will participate a joint workshop with the Photonics21 projects WIPE, L3MATRIX, PHRESCO and ICT-STREAMS. The target of the Continue reading DIMENSION meets other Photonics21 projects
On 19th September, the Workshop on Optical Data Center Interconnects – Applications, technologies and components takes place at Photonics in Switching and Computing Conference (PSC’18) Continue reading Workshop on Optical Data Center Interconnects
Co-located with Photonics in Switching and Computing Conference 2018 the 6th DIMENSION project meeting with all partners will take place in Limassol, Cyprus. The meeting Continue reading 6th DIMENSION project meeting
DIMENSION project partner OPC takes part at the Enlighten Conference on 10 October 2018 in Coventry, UK. Dr Stephen Lee will talk about alignment techniques Continue reading Optocap talks about optical alignment techniques
AIT presented the reults of their cost and power consumption comparison of 400 Gb/s intra-datacenter transceiver modules at 20th International Conference on Transparent Optical Networks Continue reading Cost and Power Study of Intra-Datacenter Transceiver Modules
DIMENSION published together with further partners a comprehensive survey of photonic and plasmonic interconnect technologies for intra-datacenter and high-performance computing communications. In this paper, we Continue reading DIMENSION contributes to IEEE Communications Surveys and Tutorials
The International Conference on Photonics in Switching and Computing takes place 19-21 September 2018 in Limassol, Cyprus. Please check out the conference flyer. DIMENSION project Continue reading International Conference on Photonics in Switching and Computing (PSC’18)
The 6th DIMENSION meeting will be co-located with the International Conference on Photonics in Switching and Computing in September 2018 in Limassol, Cyprus. During the Continue reading 6th project meeting and DIMENSION workshop at PSC’18
AIT scientists have analyzed and compared optical transceivers regarding cost and power consumption trends for 400G applications. The results are presented during the Optical Fiber Continue reading AIT presents 400G optical transceiver study at OFC’18
The project partner TUD, responsible for the demonstrator integrated circuit designs, measured their first versions of the modulator driver. Successful characterization was possible up to Continue reading TUD successfully characterizes first modulator driver circuits