1st DIMENSION review meeting and 4th project meeting
The first DIMENSION review meeting will take place on 27 September 2017 at European Commission (EC) in Brussels. The consortium is proud to present the Continue reading
Tag Archives: ict
First DIMENSION project periode sucessfully finished
By end of July 2017, the first project phase of DIMENSION was finalized. The first phase focused on the basic concepts and specification of the Continue reading
DIMENSION at ResearchGate
The DIMENSION project is now also present at ResearchGate. If you are interested, please follow.
DIMENSION partner IBM achieves conference publication
DIMENSION partner IBM achieves a publication at 75th Device Research Conference (DRC) which will take place 25-28 June in Indiana, USA. In the paper and Continue reading
Next Generation Optical Networking Conference
The DIMENSION project is to be introduced by AIT at the Next Generation Optical Networking Conference taking place 20-22 June 2017 in Nice, France. Ioannis Continue reading
DIMENSION at Silicon Saxony Day 2017
Silicon Saxony is one of Europe‘s most successful trade association for the semiconductor, electronic, microsystems and software industries including more than 300 members from industry, Continue reading
DIMENSION co-organizes workshop at ICTON 2017
The DIMENSION project is proud to get the chance to co-organize the 3rd workshop on Technology for Data Center Interconnects (DACINT) at the 19th International Continue reading
2017 spring season conferences picked up DIMENSION contributions
Spring season does not only bring life back to nature. Also the conference landscape is blooming in March and April. Therefore, aspects of the DIMENSION Continue reading
3rd DIMENSION project meeting
The third DIMENSION meeting is impending. The project consortium meets on 27 April 2017 at partner AIT in Athens, Greece to discuss the project progress Continue reading
PIC International Conference 2017 – Two DIMENSION contributions
The PIC International Conference is on the leading conference on the integrated photonics industry bringing together over 550 industry innovators and 55 exhibitors. Therefore, we Continue reading
Component specifications of DIMENSION drafted
The deliverable report D2.2 is now available. It describes the specifications for the component developments in DIMENSION. For more information, please have a look on Continue reading
DIMENSION at 11th Annual Meeting Photonic Devices
On 09 Februray 2017, Marc Seifried from IBM Zurich will present on the progress of monolithic electro-optical integration of on-chip laser sources on silicon at Continue reading
Interview with DIMENSION partners in Gazettabytes
Bert Offrein and Lars Zimmerman from the DIMENSION partners IBM and IHP, receptively, have been interview on the approaches, targets and concepts of the DIMENSION Continue reading
DIMENSION to be introduced at ECOC 2016
On September 18-22, 2016, the 42nd European Conference and Exhibition on Optical Communications (ECOC) takes place in Düsseldorf, Germany. The DIMENSION consortium takes this chance Continue reading