About the Project

DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers fundamental advantages compared to state-of-the art integration approaches. After bonding and growing ultrathin III-V structures onto the silicon front-end-of-line (FEOL), the active optical functions are embedded into the back-end-of-line (BEOL) stack. This paves the way for new innovative devices and functions at the chip-level but also for the assembly of such silicon devices. As processing takes place on silicon wafers, this project has the unique opportunity to bring the cost of integrated devices, with CMOS, photonic and III-V functionality, down to the cost of silicon volume manufacturing. Moreover, the three project demonstrators adhere to standards such as IEEE802.3, 25G optical components and low-power electronics, thus opening a viable route towards ultra-low-cost high-performance optical transceivers for a new era of data centres and cloud systems.

General Funding Information:

  • Call: H2020-ICT-2015
  • Topic: ICT-27-2015 Photonics KET
  • Instrument: Research and innovation action (RIA)
  • Project Number: 688003


  • Start Date: 01 February 2016
  • Duration: 56 months
  • End Date: 30 September 2020


  • Overall Cost: 3 422 128.75 €
  • Funding: 2 621 758.75 €

Project Partners:

  • Technische Universität Dresden (TUD), GERMANY
  • IBM Research GmbH (IBM), SWITZERLAND
  • IHP Microelectronics (IHP), GERMANY
  • ADVA Optical Networking (ADV), GERMANY
  • Athens Information Technology (AIT), GREECE

Read more: