DIMENSION contributes to IEEE Communications Surveys and Tutorials

DIMENSION published together with further partners a comprehensive survey of photonic and plasmonic interconnect technologies for intra-datacenter and high-performance computing communications. In this paper, we have surveyed available literature and compare short-range interconnect technologies with respect to their suitability for high-speed and energy-efficient on-chip and off-chip communications. We have compared different interconnect device modules, including low-energy output devices, photodetectors, passive devices and electrical circuitry. In conclosion, we have shown that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term.