DIMENSION forms a complete supply from research to commercialization including architecture, component design, semiconductor technology and fabrication, packaging, up to the end-user applications. The picture below indicates the fields where the DIMENSION partners enable significant advances and are able to exploit project reults.
The results of DIMENSION will have substantial impact on the following applications:
- Datacenters – Substantial opportunities for power consumption reduction,
- Opto-electronic products – new opportunities for advanced products with significant reduction of packaging costs,
- European silicon manufacturing – Integrated laser sources are not available in any of the so far announced silicon photonics technologies, but will be enabled by DIMENSION.
Therefore, DIMENSION enables a BREAHTHROUGH technology by:
- First CMOS embedded laser combining (Bi)CMOS electronics, with passive and active optical functions,
- Flexible and low-cost electro-optical chip design, overall on-chip control and cost-effective electro-optical integration on large-area silicon substrates.
Further applications of DIMENSION include:
- Optical interconnects
- Optical communications
- Electro-optical communication systems
- Silicon photonics
- Electro-optical integration technology
- High-speed energy-efficient integrated circuit design
- Optical component design
- Electro-optical packaging
- Smart integrated optical sensors
- Mobile & wearable applications
DIMENSION also offers complementary topics for potential collaboration and synergies with other projects in the area, e.g.: