6th DIMENSION project meeting
Co-located with Photonics in Switching and Computing Conference 2018 the 6th DIMENSION project meeting with all partners will take place in Limassol, Cyprus. The meeting Continue reading 6th DIMENSION project meeting
Optocap talks about optical alignment techniques
DIMENSION project partner OPC takes part at the Enlighten Conference on 10 October 2018 in Coventry, UK. Dr Stephen Lee will talk about alignment techniques Continue reading Optocap talks about optical alignment techniques
Cost and Power Study of Intra-Datacenter Transceiver Modules
AIT presented the reults of their cost and power consumption comparison of 400 Gb/s intra-datacenter transceiver modules at 20th International Conference on Transparent Optical Networks Continue reading Cost and Power Study of Intra-Datacenter Transceiver Modules
DIMENSION contributes to IEEE Communications Surveys and Tutorials
DIMENSION published together with further partners a comprehensive survey of photonic and plasmonic interconnect technologies for intra-datacenter and high-performance computing communications. In this paper, we Continue reading DIMENSION contributes to IEEE Communications Surveys and Tutorials
International Conference on Photonics in Switching and Computing (PSC’18)
The International Conference on Photonics in Switching and Computing takes place 19-21 September 2018 in Limassol, Cyprus. Please check out the conference flyer. DIMENSION project Continue reading International Conference on Photonics in Switching and Computing (PSC’18)
6th project meeting and DIMENSION workshop at PSC’18
The 6th DIMENSION meeting will be co-located with the International Conference on Photonics in Switching and Computing in September 2018 in Limassol, Cyprus. During the Continue reading 6th project meeting and DIMENSION workshop at PSC’18
AIT presents 400G optical transceiver study at OFC’18
AIT scientists have analyzed and compared optical transceivers regarding cost and power consumption trends for 400G applications. The results are presented during the Optical Fiber Continue reading AIT presents 400G optical transceiver study at OFC’18
TUD successfully characterizes first modulator driver circuits
The project partner TUD, responsible for the demonstrator integrated circuit designs, measured their first versions of the modulator driver. Successful characterization was possible up to Continue reading TUD successfully characterizes first modulator driver circuits
Deliverable on basic component characterization posted
The D5.1 report on the deliverable for basic component characterization is available under the deliverables section.
5th DIMENSION project meeting
The 5th DIMENSION meeting is impending. The project consortium meets on 22-23 April 2018 at partner IHP in Berlin, Greece to discuss the project progress Continue reading 5th DIMENSION project meeting
IBM achieved Best Student Paper Award
With a publication on “Monolithic integration of InAlAs/InGaAs quantum-well on InP-OI micro-substrates on Si for infrared light sources”, Y. Baumgartner from DIMENSION project partner IBM Continue reading IBM achieved Best Student Paper Award
1st DIMENSION review meeting and 4th project meeting
The first DIMENSION review meeting will take place on 27 September 2017 at European Commission (EC) in Brussels. The consortium is proud to present the Continue reading 1st DIMENSION review meeting and 4th project meeting
First DIMENSION project periode sucessfully finished
By end of July 2017, the first project phase of DIMENSION was finalized. The first phase focused on the basic concepts and specification of the Continue reading First DIMENSION project periode sucessfully finished
DIMENSION at ResearchGate
The DIMENSION project is now also present at ResearchGate. If you are interested, please follow.
DIMENSION partner IBM achieves conference publication
DIMENSION partner IBM achieves a publication at 75th Device Research Conference (DRC) which will take place 25-28 June in Indiana, USA. In the paper and Continue reading DIMENSION partner IBM achieves conference publication
Next Generation Optical Networking Conference
The DIMENSION project is to be introduced by AIT at the Next Generation Optical Networking Conference taking place 20-22 June 2017 in Nice, France. Ioannis Continue reading Next Generation Optical Networking Conference
DIMENSION at Silicon Saxony Day 2017
Silicon Saxony is one of Europe‘s most successful trade association for the semiconductor, electronic, microsystems and software industries including more than 300 members from industry, Continue reading DIMENSION at Silicon Saxony Day 2017
DIMENSION co-organizes workshop at ICTON 2017
The DIMENSION project is proud to get the chance to co-organize the 3rd workshop on Technology for Data Center Interconnects (DACINT) at the 19th International Continue reading DIMENSION co-organizes workshop at ICTON 2017
2017 spring season conferences picked up DIMENSION contributions
Spring season does not only bring life back to nature. Also the conference landscape is blooming in March and April. Therefore, aspects of the DIMENSION Continue reading 2017 spring season conferences picked up DIMENSION contributions
3rd DIMENSION project meeting
The third DIMENSION meeting is impending. The project consortium meets on 27 April 2017 at partner AIT in Athens, Greece to discuss the project progress Continue reading 3rd DIMENSION project meeting
PIC International Conference 2017 – Two DIMENSION contributions
The PIC International Conference is on the leading conference on the integrated photonics industry bringing together over 550 industry innovators and 55 exhibitors. Therefore, we Continue reading PIC International Conference 2017 – Two DIMENSION contributions
Component specifications of DIMENSION drafted
The deliverable report D2.2 is now available. It describes the specifications for the component developments in DIMENSION. For more information, please have a look on Continue reading Component specifications of DIMENSION drafted
DIMENSION at 11th Annual Meeting Photonic Devices
On 09 Februray 2017, Marc Seifried from IBM Zurich will present on the progress of monolithic electro-optical integration of on-chip laser sources on silicon at Continue reading DIMENSION at 11th Annual Meeting Photonic Devices
Interview with DIMENSION partners in Gazettabytes
Bert Offrein and Lars Zimmerman from the DIMENSION partners IBM and IHP, receptively, have been interview on the approaches, targets and concepts of the DIMENSION Continue reading Interview with DIMENSION partners in Gazettabytes
DIMENSION to be introduced at ECOC 2016
On September 18-22, 2016, the 42nd European Conference and Exhibition on Optical Communications (ECOC) takes place in Düsseldorf, Germany. The DIMENSION consortium takes this chance Continue reading DIMENSION to be introduced at ECOC 2016