Silicon Saxony is one of Europe‘s most successful trade association for the semiconductor, electronic, microsystems and software industries including more than 300 members from industry, Continue reading DIMENSION at Silicon Saxony Day 2017
The DIMENSION project is proud to get the chance to co-organize the 3rd workshop on Technology for Data Center Interconnects (DACINT) at the 19th International Continue reading DIMENSION co-organizes workshop at ICTON 2017
Spring season does not only bring life back to nature. Also the conference landscape is blooming in March and April. Therefore, aspects of the DIMENSION Continue reading 2017 spring season conferences picked up DIMENSION contributions
The third DIMENSION meeting is impending. The project consortium meets on 27 April 2017 at partner AIT in Athens, Greece to discuss the project progress Continue reading 3rd DIMENSION project meeting
The PIC International Conference is on the leading conference on the integrated photonics industry bringing together over 550 industry innovators and 55 exhibitors. Therefore, we Continue reading PIC International Conference 2017 – Two DIMENSION contributions
The deliverable report D2.2 is now available. It describes the specifications for the component developments in DIMENSION. For more information, please have a look on Continue reading Component specifications of DIMENSION drafted
On 09 Februray 2017, Marc Seifried from IBM Zurich will present on the progress of monolithic electro-optical integration of on-chip laser sources on silicon at Continue reading DIMENSION at 11th Annual Meeting Photonic Devices
Bert Offrein and Lars Zimmerman from the DIMENSION partners IBM and IHP, receptively, have been interview on the approaches, targets and concepts of the DIMENSION Continue reading Interview with DIMENSION partners in Gazettabytes
On September 18-22, 2016, the 42nd European Conference and Exhibition on Optical Communications (ECOC) takes place in Düsseldorf, Germany. The DIMENSION consortium takes this chance Continue reading DIMENSION to be introduced at ECOC 2016
From 15-16 September 2016 the DIMENSION partners will meet for the second time at ADVA in Meiningen Germany. The 2nd project meeting will be used Continue reading 2nd DIMENSION project meeting
The deliverable report on the DIMENSION system specifications have been published. Please have a closer look in the deliverable section under publications.
Definitions and rules for the handling of research data in the DIMENSION project were summized in the data management plan, which can be found in Continue reading Handling of DIMENSION data defined
From 01 to 04 August 2016 the 2nd Summer School on Optical Interconnects, organized by the PhoxTroT EU project, takes place at University of St. Continue reading DIMENSION at 2nd Summer School on Optical Interconnects
Jim Theodoras, Senior Director of Business Development at ADVA Optical Networking included an introduction of the DIMENSION project into his talk at 18th Annual Next Continue reading 18th Annual Next Generation optical networking
DIMENSION was mentioned and introduced in several media. Please check out the press section under publications.
The first DIMENSION deliverable on the public presentation and fact sheet was completed. Please see deliverable section under publications for more information and documents.
Bert Offrein from project partner IBM was invited to a talk about silicon photonics electro-optical integration in support of scalable DC architectures during the Data Continue reading OFC 2016 – Data Center Summit
DIMENSION partner IBM (M. Seifried) gave a talk on the state of the art and progress of III-V integration technologies on silicon during the 2nd Continue reading DIMENSION presentation at DATE 2016
The DIMENSION project was introduced by the partner IBM at the CS International Conference 2016 on 02 March in Brussels.
The DIMENSION project will be introduced and explained on the Photonics21 PPP annual meeting on 01-02 March 2016 in Brussels.
On 08 February 2016 the DIMENSION consortium partners met for the first time at TU Dresden, Germany. In the kick-off meeting all partners were introduced Continue reading DIMENSION kick-off meeting
On 01 February 2016 the H2020 project DIMENSION (Directly Modulated Lasers on Silicon) officially started. The aim of the project will be the development of Continue reading DIMENSION project started